1. Substrate
Steel or aluminium alloy, degreased and clean.
ST-C-CHIP
Combined thermal layer and impact skin for packs, chassis, cabinets and selected tanks.
Stone-chip family. Impact class and UL94 sit on this card. Consumption figures with broken units stay off the page.
| Property | Typical figure | Note |
|---|---|---|
| Stone-chip resistance | ISO 20567-1B Class 0.5 | Named method on the family card |
| Chemical resistance | No blistering, cracking or delamination after 24 h as stated | Family card |
| Adhesion | Class 1 as stated | Family card |
| Flammability | UL94-2023 V-0 | As stated on the family card |
| Thermal conductivity | < 0.04 W/(m·K) at 25 °C | Typical with temperature as stated |
| Wear / damp-heat / salt spray | Wear as stated · Class 1 damp-heat · 1 000 h salt, corrosion < 2 mm | Family card |
| Restricted substances | RoHS-oriented statement on the family card | Attach the current file with the pack |
| Weathering | 400 h light-aging screen as stated | Family card |
| Dry-film window | 1–20 mm as designed | Primer < 0.2 mm; interface agent 20–30 µm if needed |
| Application | Airless spray | Degreased substrate; surface tension 36–38 mN/m as stated |
Values on this page are typical figures as stated for this family. They are not SHINETON-guaranteed field results. Specify only from the current Technical Data Sheet for the supplied grade.
Operating conditions, acceptance criteria and system design stay with the buyer’s engineer. SHINETON matches the grade, issues documents and agrees inspection and shipment scope.
Steel or aluminium alloy, degreased and clean.
Anti-rust primer and interface agent where the system calls for them.
Build to the specified dry thickness. Cure schedule is on the TDS.